The materials used in standard FR-4 PCBs and conventional MCPCBs often inhibit radio signals by introducing noise and electromagnetic interference, so COFAN developed the new Ultra-RF Ceramic MCPCB™ that allows for full signal pass-through. As the name suggests, we use low di-electric impedance materials that enable a stronger, higher frequency signal commonly used in routers and Bluetooth devices. Other uses include solid-state amplifiers, low- and high-pass filter amplifiers, signal converters, and more.

The Ultra-RF Ceramic MCPCB™ uses plated, grounding vias with customizable layers of copper to create a reference layer, minimizing di-electric loss, offering better impedance control, and ensuring signal integrity. On the back, we use nickel or tin-plated aluminum for direct metal-to-metal bonding, increasing heat dissipation. The Ultra-RF MCPCB™ is COFAN’s simple yet effective solution designed to meet all your radio-frequency needs.