FR-4 PCBS
FR-4 PCBs
Most people don’t realize that everything is controlled with a PCB. Whether it’s your mouse, your keyboard, your phone, your TV, or your router, electronics are dependent on PCBs.
FR-4 is the material upon which the vast majority of PCBs are made. FR-4 PCBs are seen as the standard PCB because of their cost-effectiveness. For applications that don’t produce extreme heat, FR-4 PCBs are your tried-and-true solution.
FR-4 copper-clad sheets are fabricated with circuitry etched into copper layers and become more complex as more layers are added. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel, commonly referred to as “copper-clad laminates.”
For more information on FR-4 PCB capabilities and how we can customize these boards for you, please see PCB Capabilities.
Product Samples
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Process
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Item
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Normal SPEC
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Special SPEC
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|---|---|---|---|
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01/ Materials
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150℃ to 180℃ Layer count
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16 L
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20 L
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02/ Mask
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Color
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Green / blue / Red / Black / White / Golden / Clear
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03/ Silkscreen
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Color
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White / Black / Red / Yellow
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04/ Testing
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1. Open / Short Testing Spacing
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Dedicate: 6ml Fly probe, Spacing: 4mil (Smd Pitch: 10 mil)
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Tolerance 5%
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2. Open / Short Board Size
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Dedicate: 600x400mm(max) , Fly probe: 640x450mm(max)
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3. Open / Short Testing Condition
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Dedicate: 250V / 50Ω / 2MΩ Fly probe: 250V / 50Ω / 10MΩ min / max: 1MΩ ~ 20MΩ |
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4. Netlist Test
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1) Measure Machine: POLAR 2) Tolerance: ±10% 3) design: Single End / Differential ±10% 4) Testing Pitch: 0.254mm |
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05/ Finish Type
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HASL Carbon Ink Imm gold Hard gold Imm Tin Leadfree HAL Imm Silver |
Imm Gold+HASL Imm Gold+ENTEK Carbon+ENTEK Imm gold+G / F(3~30μ) Partial Hard Gold Partial Imm Gold |
Imm Gold + SMOBC
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Density
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|||
|---|---|---|---|
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Title
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Standard
|
Advanced & Development
|
|
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Thickness Tolerance
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+/- 8
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+/- 6
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|
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Thickness (Minimum / Maximum)
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7 / 300
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5 / 440
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QFP
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0.5 mm
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0.4mm
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|
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Minimum Solder mask Web
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0.005
|
0.004
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Minimum Prepreg Fill
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0.0025
|
0.002
|
|
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Minimum Line/Spacing - Internal 1/2 oz
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0.004
|
0.003 1/3 oz
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Minimum Line/Spacing - External 1/2 oz
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0.004
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0.003 1/3 oz
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|
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Minimum Drilled Hole Size
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0.008
|
0.006
|
|
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Minimum Core Thickness
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0.004
|
0.003
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Layer to Layer Registration
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+/- .005
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+/- .003
|
|
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Land Size (Diameter over Drill)
|
0.010
|
0.008
|
|
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BGA
|
0.5 mm
|
0.4mm
|
|
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Aspect Ratio - Line Card
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12:01
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14:01
|
|
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HDI VIAS
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|||
|---|---|---|---|
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Title
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Dimension
|
Advanced & Development
|
|
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Microvia Aspect Ratio
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0.5:1
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|
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Variable Depth Laser Via (Depth / Diameter)
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0.004/ 0.006
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0.004/ 0.005
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Minimum Laser Via (Drill / Capture Pad)
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0.006/ 0.016
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0.005/ 0.014
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|
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BBV Mechanical Drill
|
0.010
|
0.008
|
|
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Impedance Control
|
|||
|---|---|---|---|
|
Title
|
Standard
|
Advanced & Development
|
|
|
28 - 260Ohms
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+/-10%
|
+/-7%
|
|
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50 - 150 Ohms
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+/-10%
|
+/-7%
|
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Copper Weights
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|||
|---|---|---|---|
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Title
|
Standard
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Advanced & Development
|
|
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Min Outer Base Copper - plated layers
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1/2 oz
|
1/4 oz
|
|
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Max Outer Base Copper - plated layers
|
5 oz
|
5 oz
|
|
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Max Inner Copper Foil - non plated layers
|
4 oz
|
5 oz
|
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Min Inner Copper Foil - non plated layers
|
1/4 oz
|
1/4 oz
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