RIGID & FLEX PCBs
Twist it, bend it, and shape it
COFAN’s Flexible PCBs are designed to bend, twist, and fold without breaking, making them ideal for next-generation electronics such as foldable smartphones, wearable devices, and flexible displays.
It’s not only about flexibility — some applications require products to stay rigid in certain areas while remaining flexible in others. That’s why COFAN provides advanced Rigid-Flex PCB solutions.
With the perfect balance of durability and adaptability, our Rigid-Flex PCBs deliver superior reliability, space savings, and design freedom across a wide range of industries.
Fabrication Capabilities
|
Item
|
Test Results
|
|---|---|
|
Layer to Layer Registration Tolerance
|
+/- 75 um (for multilayer mass production)
|
|
Layer Count
|
Standard: 1 – 4 layers (Capabilities: 1 - 6 layers)
|
|
Material
|
Polyimide (variety of brands available)
|
|
Plating finishes
|
Copper, Gold, Nickel, Silver, Tin, Tin-lead
|
|
Minimum Drilled Hole
|
100um(Finished)
|
|
X-Y inspection tolerance
|
± 75 um
|
|
Minimum Line Width/ Spacing
|
Standard: 100 um Capabilities: 40.6 um (1/3-1/2 OZ conductor)
|
|
Drilling/punching tolerance
|
± 50~75 um
|
|
Shielding
|
RFI / EMI provides 70(+) DB isolation from 50MHz to 12 GHz
|
|
Controlled impedance
|
40 ohms to 100 ohms
|
|
Aspect Ratio
|
9:1
|
|
Max Panel Sizes
|
Single Sided: 500 mmX 2000 mm Roll to roll is available for single sided Double or Multilayer: 480mmX 480mm |
FPC Design Guidelines
Button Plate Trace/Space and Thickness
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
Leading Edge (µm)
|
|---|---|---|---|
|
Min. Space width between Traces ( >= 12um Cu Foil) |
FPC DR 1_Trace Width & Space
|
50
|
40
|
|
Min. Space width between Traces ( >=9um Cu Foil) |
FPC DR 1_Trace Width & Space
|
30
|
25
|
|
Min. Space width between Traces ( <= 18um Cu Foil) |
FPC DR 1_Trace Width & Space
|
60
|
50
|
|
Max. Plated button finished thickness (above base copper) |
FPC DR_Button Ht
|
20
|
20
|
|
Min. Trace width ( >= 9um Cu Foil)
|
FPC DR 1_Trace Width & Space
|
30
|
40
|
|
Min. Trace width ( >= 12um Cu Foil)
|
FPC DR 1_Trace Width & Space
|
50
|
50
|
Plated Through Hole (PTH)
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
Leading Edge (µm)
|
|---|---|---|---|
|
Min. Mechanical Drilled PTH Diameter
|
FPC DR_PTH
|
150
|
100
|
|
Min. Laser Drilled Via Pad Size (Panel Plate)
|
FPC DR_PTH
|
450
|
350
|
|
Min. Laser Drilled Via Pad Size (Button Plate)
|
FPC DR_PTH
|
400
|
3
|
|
Min. Laser Drilled PTH Diameter
|
FPC DR_PTH
|
75
|
75
|
|
Min. Mechanical Drilled Via Pad Size (Panel Plate)
|
FPC DR_PTH
|
300
|
275
|
|
Min. Mechanical Drilled Via Pad Size (Button Plate)
|
|
225
|
175 (LDI)
|
Copper to Copper / Holes / Slot / Bds Outline Clearance
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
Leading Edge (µm)
|
|---|---|---|---|
|
Min. Trace/Ground/Via Pad to SMD Component Pad Edge (Photoimaged Mask) |
FPC DR_Cu/SMD Pad
|
100
|
|
|
Min. Copper Edge to outline Edge
|
FPC DR_ Cu to Bds Outline
|
200
|
150
|
|
Min. layer to layer registration tolerance - 3 to 6 layers
|
FPC DR_ Lyr_lyr registration
|
75
|
|
|
Min. layer to layer registration tolerance - 2 layers
|
FPC DR_ Lyr_lyr registration
|
50
|
30
|
|
Min. space from via pads/trace/grounds to ground (I/L <=18um Cu Foil) |
FPC DR_ T-V_V-V_VTG-G
|
75
|
|
|
Min. space from via pads/trace/grounds to ground (O/L <=18um Cu Foil, button plated) |
FPC DR_ T-V_V-V_VTG-G
|
75
|
|
|
Min. Copper edge to NPTH or Non-Plated Slot Edge
|
FPC DR_ Cu/Bds edge to NPTH or non-plated slot
|
200
|
150
|
|
Min. Via Captured Pad to Via Captured Pad
|
FPC DR_ T-V_V-V_VTG-G
|
100
|
75
|
|
Min. Non-plated slot or NPTH edge to outline edge
|
FPC DR_ Cu/Bds edge to NPTH or non-plated slot
|
200
|
150
|
|
Min. trace to via captured pad ( I/L <= 18um Cu Foil) |
FPC DR_ T-V_V-V_VTG-G
|
100
|
75
|
|
Min. trace to via captured pad ( O/L <= 18um Cu Foil, button plated) |
FPC DR_ T-V_V-V_VTG-G
|
100
|
|
|
Min. trace to via captured pad ( O/L finished thickness = 40um) |
FPC DR_ T-V_V-V_VTG-G
|
100
|
75
|
|
Min. SMD Component Pad to SMD Component Pad (Coverlay) |
|
600
|
400
|
|
Min. SMD Component Pad to SMD Component Pad (Photoimaged Mask) |
FPC DR_NSMD Space
|
200
|
150
|
|
Min. Trace/Ground/Via Pad To NSMD Component Pad Edge (Coverlay) |
FPC DR_NSMD Space
|
150
|
|
|
Min. Trace/Ground/Via Pad To NSMD Component Pad Edge (Photoimaged Mask) |
FPC DR_NSMD Space
|
100
|
|
|
Min. Trace/Ground/Via Pad to SMD Component Pad Edge (Coverlay) |
FPC DR_Cu/SMD Pad
|
200
|
|
Soldermask / Coverlay / Stiffener
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
|---|---|---|
|
Min. Space Between Soldermask Edge to Component pad edge |
FPC DR_ SM/CV & Tolerance
|
50
|
|
Min. Stiffener edge extention beyond all supported Cu pad edge |
FPC DR 82
|
500
|
|
Min. Stiffener to Stiffener Gap
|
FPC_DR80
|
1500
|
|
Min. EMI Shielding film edge to Component Pad edge
|
FPC DR 39_40
|
500
|
|
EMI shielding film placement tolerance
|
FPC DR 39_40 ±300
|
±300
|
|
Min. Stiffener Edge to Start of Bend
|
FPC_DR80
|
500
|
|
Min. Stiffener Edge to Airgap edge
|
FPC_DR80
|
1000
|
|
Min. Coverlay Width (Dam)
|
FPC DR_ SM/CV & Tolerance
|
300
|
|
Min. Space Soldermask to NPTH or Non-Plated Slot
|
FPC DR_ SM/CV & Tolerance
|
75
|
|
Min. Soldermask Width (Dam)
|
FPC DR_ SM/CV & Tolerance
|
100
|
|
Coverlay to outerlayer pattern alignment Tolerance
|
FPC DR_ SM/CV & Tolerance
|
±150
|
|
Min. Space Coverlay to NPTH or Non-Plated Slot
|
FPC DR_ SM/CV & Tolerance
|
250
|
|
Soldermask to outerlayer pattern alignment Tolerance
|
FPC DR_ SM/CV & Tolerance
|
±50
|
|
Max Coverlay opening size Tolerance (Including the adhesive flow) |
FPC DR_ SM/CV & Tolerance
|
130
|
|
Minimum coverlay opening size
|
FPC DR_ SM/CV & Tolerance
|
|
|
Stiffener placement tolerance
|
FPC_DR80
|
±300
|
|
Min. Space Between Coverlay Edge to Component pad edge
|
FPC DR_ SM/CV & Tolerance
|
150
|
|
Minimum soldermask opening size
|
FPC DR_ SM/CV & Tolerance
|
75
|
Tooling for Profile
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
Leading Edge (µm)
|
|---|---|---|---|
|
Outline Tolerance
|
FPC DR_ FPC outline
|
±100
|
±50
|
|
Max. Slot Length (# x Width)
|
FPC DR_Slot Width/Length
|
6 times
|
|
|
Min. Slot Width
|
FPC DR_Slot Width/Length
|
500
|
|
|
Hole / Slot Edge to Outline Tolerance
|
FPC DR_ FPC outline
|
±80
|
±50
|
|
Min. Hole / Slot Edge to Outline Distance
|
FPC DR_ FPC outline
|
500
|
|
|
Hole / Slot to Hole / Slot tolerance
|
FPC DR_ FPC outline
|
80
|
|
|
Min. Hole / Slot edge to Hole / Slot edge distance
|
FPC DR_ FPC outline
|
1000
|
|
|
Punched Hole / Slot Position Tolerance
|
FPC DR_ FPC outline
|
80
|
|
|
Punched Hole Diameter tolerance
|
FPC DR_ FPC outline
|
±50
|
|
|
Min. Punched Hole Diameter
|
FPC DR_ FPC outline
|
500
|
|
|
Min. Inside Corner Radius
|
FPC DR_ FPC outline
|
400
|
|
|
Min. Outside Corner radius
|
FPC DR_ FPC outline
|
200
|
|
others
|
Design Rule Parameter
|
Drawing/Pictures
|
Production Zero Base (µm)
|
Leading Edge (µm)
|
|---|---|---|---|
|
Min. total contact bond area (cm2) per cm2 of effective EMI Shielding Film surface |
FPC DR 89_90
|
0.01/contact
|
|
|
Min. Cu Edge (exclude trace thru' airgap) to AirGap Edge -- > 4 layers |
FPC DR_Cu/Air Gap Distance
|
1500
|
|
|
Min. Cu Edge (exclude trace thru' airgap) to AirGap Edge -- 2 to 4 layers |
FPC DR_Cu/Air Gap Distance
|
1000
|
|
|
Min. Cu Edge (outside of Stiffener footprint) to Stiffener Edge |
FPC DR 81
|
500
|
|
|
Min. AirGap Length for 5 to 6 Layers FPC
|
FPC DR_Air Gap Length
|
5000
|
|
|
Min. AirGap Length for 3 to 4 Layers FPC
|
FPC DR_Air Gap Length
|
3000
|
|
|
Min. single contact bond area (mm2) with EMI Shielding Film |
FPC DR 89_90
|
1
|
|
|
Silkscreen alignment to board outline (tolerance)
|
|
±500
|
|
|
Max. Trace Width in Static bend region only (finished thickness >18um / <= 40um) |
FPC DR_Trace Width at Bend
|
250
|
|
|
Max. Trace Width in bend region (<= 12um ED or RA Cu Foil) |
FPC DR_Trace Width at Bend
|
100
|
|
|
Min. Ground opening edge to Outline edge
|
FPC DR_Circular/sloted gnd
|
200
|
|
|
Max. Ground to ground pitch
|
FPC DR_Circular/sloted gnd
|
700
|
|
|
Min. Ground to ground pitch
|
FPC DR_Circular/sloted gnd
|
625
|
|
|
Max. Ground opening diameter
|
FPC DR_Circular/sloted gnd
|
500
|
|
|
Min. Ground opening diameter
|
FPC DR_Circular/sloted gnd
|
200
|
|
|
Max. space width of Parallel trace ground
|
FPC DR_Circular/sloted gnd
|
200
|
|
|
Min. space width of Parallel trace ground
|
FPC DR_Circular/sloted gnd
|
125
|
|
|
Max. width of Parallel trace ground
|
FPC DR_Circular/sloted gnd
|
500
|
|
|
Min. width of Parallel trace ground
|
FPC DR_Circular/sloted gnd
|
200
|
|
Applications
Rigid PCBs are the most common type, made from solid, non-bendable substrates like fiberglass (FR4). They provide a stable structure and are used in applications requiring durability and reliability.