Super Pillar case study
Super Pillar™ Technology Case Study
When COFAN’s customers want the best in thermal management for PCBs, we recommend our patented Super Pillar™ technology.
We don’t expect you to trust us on faith alone so we’ve partnered up with a customer of ours to do thermal tests (with a FLIR camera), pitting our Super Pillar™ against our competitor’s aluminum and copper MCPCBs with real, hard numbers.
Thermal Performance Test
- 3 array constructions tested
- Super Pillar, copper substrate (COFAN)
- MCPCB, aluminum substrate (competitor)
- MCPCB, copper substrate (competitor)
- Target Tjmax=85°C
LED regulation to be enabled at Tjmax=90°C, intensity throttled
Competitor's MCPCB
COFAN Super Pillar technology
X-ray of the Super Pillar
Cofan's Super Pillar Thermal Temperatures
Cofan's 2 Layer Copper Super Pillar
Spot 1 temperature: 94.5℃ (Tjmax)
Spot 2 temperature: 77.0℃
Sekisui KNDJ002 3mil
Breck Heatsink
2500B5601-COFAN-1A SN 03
1050mA / 1225mA (Lime)
t=30s
Sunon PMD2412PMB1-A(2).GN at 12V
Competitor Aluminum Thermal Temperatures
Competitor Copper Thermal Temperatures
Competitor's 2 Layer Aluminum
Spot 1 temperature: 96.5℃
Spot 2 temperature: 113.9℃ (Tjmax)
Breck heatsink
2500B5601-1A SN 05
1050mA / 1225mA (Lime)
t=30s
Sunon PMD2412PMB1-A(2).GN at 12V
Competitor's 2 Layer Copper
Spot 1 temperature: 88.9℃
Spot 2 temperature: 99.0℃ (Tjmax)
Breck Heatsink
2500B5601-1A SN 05
1050mA / 1225mA (Lime)
t=30s
Sunon PMD2412PMB1-A(2).GN at 12V
Conclusion
Performance is highly dependent on the dielectric thickness.
There was a 33% improvement in cross-sectional areas when changing from 0.004” to 0.003” dielectric material.
High-performance dielectrics alone did not provide adequate dissipation from the LED package. A large, direct conduit (like COFAN’s Super Pillar technology) is needed to draw sufficient heat away from the LEDs.
Our customer, convinced by the test, proceeded to order our 2-layer Super Pillar™ product for its low LED temperatures